Simple Modelling Approach for Via-Hole Characterization on Silicon Substrate at Ka-Band
نویسندگان
چکیده
This work presents a simple model of via-hole using electromagnetic field solver. Equivalent model parameters on Si are found out at Ka-band. Proposed single via-hole model has been compared with theoretical published data. The effect of viahole radius and substrate height at Ka-band frequencies has been studied. Further, S-parameter analysis and comparison for multiple vias at two different frequency bands is carried out.
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